DIGIPLUS Signed a MoU with Dhanalakshmi Srinivasan Institute of Technology (தனலக்ஷ்மி சீனிவாசன் இன்ஸ்டிடியூட் ஆப் டெக்னாலஜி)
Digiplus is delighted to announce its association with Dhanalakshmi Srinivasan College Trichy as a trusted Corporate partner for student skill development and internship. Through this partnership, Digiplus aims to impart technological advancements and provide employment opportunities to the students from the Departments of Computer Science and Data Science at Dhanalakshmi Srinivasan College.
Digiplus is committed to providing a conducive learning environment during the internship period, where students can work on real-world projects and interact with experienced professionals in the field. This hands-on experience will help them bridge the gap between academic knowledge and industry requirements, making them better prepared for future career prospects.
In a significant step toward fostering industry-academic collaboration, Dhanalakshmi Srinivasan College has entered into a Memorandum of Understanding (MoU) with Digiplus, a leading Web design company, Digital Marketing Company, SEO Company, Graphics Designing Company in Trichy. The MoU was officially signed on 18-9-2024 inside the college premises.
Purpose of the MoU
The primary objective of this MoU is to bridge the gap between academic learning and industry practices by providing students with exposure to real-world applications of software development and technology solutions. This partnership is set to enhance the skill sets of students and improve their employability prospects in the competitive tech market.
Digiplus will offer internship opportunities to Dhanalakshmi College students, allowing them to work on live projects and gain hands-on experience. The company will also conduct specialized training sessions in emerging technologies.
One of the highlights of this agreement is the promise of placement support. Students excelling in their internships or training programs will have an opportunity to secure job placements with Digiplus.
